Tšebeliso eafoil ea koporoliforeiming tse nang le loto li bonahala haholo-holo likarolong tse latelang:
● Khetho ea lintho tse bonahalang:
Liforeimi tse etellang pele hangata li entsoe ka li-alloys tsa koporo kapa lisebelisoa tsa koporo hobane koporo e na le conductivity e phahameng ea motlakase le conductivity e phahameng ea mocheso, e ka netefatsang phetisetso e nepahetseng ea matšoao le taolo e ntle ea mocheso.
● Mokhoa oa ho etsa:
Etching: Ha ho etsoa liforeimi tse etellang pele, ho sebelisoa mokhoa oa etching. Ntlha ea pele, lera la photoresist le koahetsoe holim'a poleiti ea tšepe, ebe e pepeseha ho etchant ho tlosa sebaka se sa koahetsoeng ke photoresist ho theha mokhoa o motle oa foreimi ea lead.
Stamping: Lefu le tsoelang pele le kenngoa mochineng oa khatiso o lebelo le phahameng ho etsa foreimi ea loto ka mokhoa oa ho hatakela.
● Litlhoko tsa tšebetso:
Liforeimi tse etellang pele li tlameha ho ba le conductivity e phahameng ea motlakase, conductivity e phahameng ea mocheso, matla a lekaneng le ho tiea, sebopeho se setle, ts'ebetso e ntle ea welding le ho hanyetsa ho bola.
Li-alloys tsa koporo li ka fihlela litlhoko tsena tsa ts'ebetso. Matla a bona, ho thatafala le ho tiea ha bona ho ka fetoloa ka ho kopanya. Ka nako e ts'oanang, ho bonolo ho etsa meaho ea foreimi e rarahaneng le e nepahetseng ka ho etsa setempe se nepahetseng, electroplating, etching le lits'ebetso tse ling.
● Ho ikamahanya le maemo a tikoloho:
Ka litlhoko tsa melao ea tikoloho, li-alloys tsa koporo li kopana le mekhoa e tala ea tlhahiso e kang e se nang loto le halogen, 'me ho bonolo ho finyella tlhahiso ea tikoloho.
Ka kakaretso, ho sebelisoa ha foil ea koporo ka liforeimi tse nang le loto ho bontšoa haholo-holo ha ho khethoa lisebelisoa tsa mantlha le litlhoko tse tiileng tsa ts'ebetso ea ts'ebetso ea tlhahiso, ha ho ntse ho nahanoa ka tšireletso ea tikoloho le ts'ireletso.
Likarolo tsa foil tsa koporo tse sebelisoang hangata le thepa ea tsona:
| Alloy Grade | Sebopeho sa lik'hemik'hale % | Botenya bo fumanehang mm | ||||
|---|---|---|---|---|---|---|
| GB | ASTM | JIS | Cu | Fe | P | |
| TFe0.1 | C19210 | C1921 | phomola | 0.05-0.15 | 0.025-0.04 | 0.1-4.0 |
| Botenya g/cm³ | Modulus ea elasticity GPA | Coefficient ea ho eketsa mocheso *10-6/℃ | Conductivity ea motlakase %IACS | Thermal conductivity W/(mK) | |||||
|---|---|---|---|---|---|---|---|---|---|
| 8.94 | 125 | 16.9 | 85 | 350 | |||||
| Thepa ea mechine | Bend thepa | |||||||
|---|---|---|---|---|---|---|---|---|
| Khalefo | Ho thatafala HV | Conductivity ea motlakase %IACS | Teko ea tsitsipano | 90°R/T (T) 0.8mm) | 180°R/T (T) 0.8mm) | |||
| Matla a tšepe Mpa | Elongation % | Tsela e ntle | Tsela e mpe | Tsela e ntle | Tsela e mpe | |||
| O60 | ≤100 | ≥85 | 260-330 | ≥30 | 0.0 | 0.0 | 0.0 | 0.0 |
| H01 | 90-115 | ≥85 | 300-360 | ≥20 | 0.0 | 0.0 | 1.5 | 1.5 |
| H02 | 100-125 | ≥85 | 320-410 | ≥6 | 1.0 | 1.0 | 1.5 | 2.0 |
| H03 | 110-130 | ≥85 | 360-440 | ≥5 | 1.5 | 1.5 | 2.0 | 2.0 |
| H04 | 115-135 | ≥85 | 390-470 | ≥4 | 2.0 | 2.0 | 2.0 | 2.0 |
| H06 | ≥130 | ≥85 | ≥430 | ≥2 | 2.5 | 2.5 | 2.5 | 3.0 |
| H06S | ≥125 | ≥90 | ≥420 | ≥3 | 2.5 | 2.5 | 2.5 | 3.0 |
| H08 | 130-155 | ≥85 | 440-510 | ≥1 | 3.0 | 4.0 | 3.0 | 4.0 |
| H10 | ≥135 | ≥85 | ≥450 | ≥1 | —- | —- | —- | —- |
Nako ea poso: Sep-21-2024